CD54AC251HX vs 5962-8512401EX feature comparison

CD54AC251HX Ge Solid State

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5962-8512401EX Intersil Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GE SOLID STATE HARRIS SEMICONDUCTOR
Package Description DIE, DIP,
Reach Compliance Code unknown unknown
Family AC HC/UH
JESD-30 Code X-XUUC-N16 R-GDIP-T16
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 1 4
Number of Inputs 8 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity COMPLEMENTARY TRUE
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIE DIP
Package Equivalence Code DIE OR CHIP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Propagation Delay (tpd) 18.2 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 1.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Base Number Matches 1 2
Part Package Code DIP
Pin Count 16
HTS Code 8542.39.00.01
Seated Height-Max 5.08 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

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Compare 5962-8512401EX with alternatives