CD54AC652M96G4
vs
GTLP18T612GX
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ROCHESTER ELECTRONICS INC
|
Part Package Code |
SOIC
|
BGA
|
Package Description |
SOP,
|
LFBGA,
|
Pin Count |
24
|
54
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Family |
AC
|
GTLP
|
JESD-30 Code |
R-PDSO-G24
|
R-PBGA-B54
|
JESD-609 Code |
e4
|
|
Logic IC Type |
REGISTERED BUS TRANSCEIVER
|
REGISTERED BUS TRANSCEIVER
|
Number of Bits |
1
|
18
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
24
|
54
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
OPEN-DRAIN/3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
LFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Propagation Delay (tpd) |
15.5 ns
|
6.5 ns
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.45 V
|
Supply Voltage-Min (Vsup) |
1.5 V
|
3.15 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BICMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NOT SPECIFIED
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Position |
DUAL
|
BOTTOM
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Length |
|
8 mm
|
Moisture Sensitivity Level |
|
NOT SPECIFIED
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Seated Height-Max |
|
1.4 mm
|
Terminal Pitch |
|
0.8 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
5.5 mm
|
|
|
|
Compare CD54AC652M96G4 with alternatives
Compare GTLP18T612GX with alternatives