CD54HC00F/3
vs
74HC132D,653
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
RCA SOLID STATE
|
NEXPERIA
|
| Package Description |
,
|
SOT-108-1, SO-14
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-609 Code |
e0
|
e4
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
14
|
| Manufacturer Package Code |
|
SOT108-1
|
| Factory Lead Time |
|
6 Weeks
|
| Date Of Intro |
|
1993-09-01
|
| Samacsys Manufacturer |
|
Nexperia
|
| Family |
|
HC/UH
|
| JESD-30 Code |
|
R-PDSO-G14
|
| Length |
|
8.65 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Logic IC Type |
|
NAND GATE
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
4
|
| Number of Inputs |
|
2
|
| Number of Terminals |
|
14
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SOP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Packing Method |
|
TR, 13 INCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Propagation Delay (tpd) |
|
38 ns
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
|
6 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
3.9 mm
|
|
|
|
Compare 74HC132D,653 with alternatives