CD54HC00F/3
vs
74HC132PW,112
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
RCA SOLID STATE
|
NXP SEMICONDUCTORS
|
Package Description |
,
|
SOT-402-1, TSSOP-14
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-609 Code |
e0
|
e4
|
Terminal Finish |
TIN LEAD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Base Number Matches |
3
|
2
|
Part Package Code |
|
TSSOP
|
Pin Count |
|
14
|
Manufacturer Package Code |
|
SOT402-1
|
Family |
|
HC/UH
|
JESD-30 Code |
|
R-PDSO-G14
|
Length |
|
5 mm
|
Load Capacitance (CL) |
|
50 pF
|
Logic IC Type |
|
NAND GATE
|
Max I(ol) |
|
0.004 A
|
Moisture Sensitivity Level |
|
1
|
Number of Functions |
|
4
|
Number of Inputs |
|
2
|
Number of Terminals |
|
14
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
TSSOP
|
Package Equivalence Code |
|
TSSOP14,.25
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
|
TUBE
|
Peak Reflow Temperature (Cel) |
|
260
|
Prop. Delay@Nom-Sup |
|
31 ns
|
Propagation Delay (tpd) |
|
38 ns
|
Qualification Status |
|
Not Qualified
|
Schmitt Trigger |
|
YES
|
Seated Height-Max |
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
|
6 V
|
Supply Voltage-Min (Vsup) |
|
2 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
4.4 mm
|
|
|
|
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-
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-
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-
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-
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