CD54HC00F/3 vs MC74HC00ADD feature comparison

CD54HC00F/3 Intersil Corporation

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MC74HC00ADD Motorola Mobility LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR MOTOROLA INC
Package Description , SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-CDIP-T14 R-PDSO-G14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 135 ns 22 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 3 2
Part Package Code SOIC
Pin Count 14
Length 8.65 mm
Load Capacitance (CL) 50 pF
Seated Height-Max 1.75 mm
Supply Voltage-Nom (Vsup) 5 V
Terminal Pitch 1.27 mm
Width 3.9 mm

Compare CD54HC00F/3 with alternatives

Compare MC74HC00ADD with alternatives