CD54HC00F/3 vs MC74HC00ADG feature comparison

CD54HC00F/3 Harris Semiconductor

Buy Now Datasheet

MC74HC00ADG onsemi

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer HARRIS SEMICONDUCTOR ONSEMI
Package Description , SOIC-14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-CDIP-T14 R-PDSO-G14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 135 ns 110 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 3 2
Pbfree Code Yes
Part Package Code SOIC-14 NB
Pin Count 14
Manufacturer Package Code 751A-03
ECCN Code EAR99
Factory Lead Time 31 Weeks, 4 Days
Samacsys Manufacturer onsemi
JESD-609 Code e3
Length 8.65 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.0052 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.25
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 55 ns
Schmitt Trigger NO
Seated Height-Max 1.75 mm
Supply Voltage-Nom (Vsup) 3 V
Terminal Finish MATTE TIN
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

Compare CD54HC00F/3 with alternatives

Compare MC74HC00ADG with alternatives