CD54HC00F3A
vs
8403701CX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTERSIL CORP
HARRIS SEMICONDUCTOR
Package Description
DIP-14
DIP,
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-CDIP-T14
R-GDIP-T14
JESD-609 Code
e0
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.00002 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
27 ns
Propagation Delay (tpd)
135 ns
135 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Screening Level
38535Q/M;38534H;883B
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
5
Part Package Code
DIP
Pin Count
14
Length
19.56 mm
Moisture Sensitivity Level
NOT APPLICABLE
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Seated Height-Max
5.08 mm
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Width
7.62 mm
Compare CD54HC00F3A with alternatives
Compare 8403701CX with alternatives