CD54HC00F3A
vs
MM74HC00N_NL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
FAIRCHILD SEMICONDUCTOR CORP
Package Description
DIP-14
DIP, DIP14,.3
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
JESD-609 Code
e0
e3
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.00002 A
0.004 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
27 ns
23 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Screening Level
38535Q/M;38534H;883B
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
1
Part Package Code
DIP
Pin Count
14
Length
19.18 mm
Load Capacitance (CL)
50 pF
Packing Method
RAIL
Propagation Delay (tpd)
113 ns
Seated Height-Max
5.08 mm
Width
7.62 mm
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