CD54HC08F3A vs TC74HC08APF feature comparison

CD54HC08F3A Intersil Corporation

Buy Now Datasheet

TC74HC08APF Toshiba America Electronic Components

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTERSIL CORP TOSHIBA CORP
Package Description DIP-14 DIP, DIP14,.3
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-CDIP-T14 R-PDIP-T14
JESD-609 Code e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 27 ns 19 ns
Propagation Delay (tpd) 135 ns 95 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Screening Level 38535Q/M;38534H;883B
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 4 1
Pbfree Code Yes
Part Package Code DIP
Pin Count 14
Samacsys Manufacturer Toshiba
Length 19.25 mm
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 4.45 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

Compare CD54HC08F3A with alternatives

Compare TC74HC08APF with alternatives