CD54HC126F
vs
MC74HC126AN
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
GENERAL ELECTRIC SOLID STATE
|
ON SEMICONDUCTOR
|
| Package Description |
,
|
DIP, DIP14,.3
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Base Number Matches |
5
|
5
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
14
|
| Factory Lead Time |
|
4 Weeks
|
| Control Type |
|
ENABLE HIGH
|
| Family |
|
HC/UH
|
| JESD-30 Code |
|
R-PDIP-T14
|
| JESD-609 Code |
|
e0
|
| Length |
|
18.86 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Logic IC Type |
|
BUS DRIVER
|
| Max I(ol) |
|
0.006 A
|
| Number of Bits |
|
1
|
| Number of Functions |
|
4
|
| Number of Ports |
|
2
|
| Number of Terminals |
|
14
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
|
3-STATE
|
| Output Polarity |
|
TRUE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP14,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Prop. Delay@Nom-Sup |
|
27 ns
|
| Propagation Delay (tpd) |
|
135 ns
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
4.69 mm
|
| Supply Voltage-Max (Vsup) |
|
6 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Supply Voltage-Nom (Vsup) |
|
3 V
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
7.62 mm
|
|
|
|
Compare MC74HC126AN with alternatives