CD54HC132F/3 vs CD54HCT132F3A feature comparison

CD54HC132F/3 Intersil Corporation

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CD54HCT132F3A Intersil Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR INTERSIL CORP
Package Description , DIP, DIP14,.3
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH
JESD-30 Code R-CDIP-T14 R-XDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 188 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 3
Rohs Code No
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 50 ns
Schmitt Trigger YES
Screening Level 38535Q/M;38534H;883B
Supply Voltage-Nom (Vsup) 5 V
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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