CD54HC132F/3 vs MM74HC132M feature comparison

CD54HC132F/3 Intersil Corporation

Buy Now Datasheet

MM74HC132M Rochester Electronics LLC

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer HARRIS SEMICONDUCTOR ROCHESTER ELECTRONICS INC
Package Description , SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-CDIP-T14 R-PDSO-G14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 188 ns 125 ns
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 3 5
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 14
JESD-609 Code e3
Length 8.6235 mm
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.753 mm
Supply Voltage-Nom (Vsup) 4.5 V
Terminal Finish MATTE TIN
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

Compare CD54HC132F/3 with alternatives