CD54HC132F/3A
vs
MC74HC03AF
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
ON SEMICONDUCTOR
|
| Reach Compliance Code |
unknown
|
compliant
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-CDIP-T14
|
R-PDSO-G14
|
| JESD-609 Code |
e0
|
e4
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
188 ns
|
180 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
SOIC
|
| Package Description |
|
SSOP,
|
| Pin Count |
|
14
|
| HTS Code |
|
8542.39.00.01
|
| Length |
|
6.2 mm
|
| Output Characteristics |
|
OPEN-DRAIN
|
| Package Code |
|
SSOP
|
| Seated Height-Max |
|
2 mm
|
| Supply Voltage-Nom (Vsup) |
|
3 V
|
| Terminal Pitch |
|
0.65 mm
|
| Width |
|
5.3 mm
|
|
|
|
Compare CD54HC132F/3A with alternatives
Compare MC74HC03AF with alternatives