CD54HC132F/3A vs TC74HC00AF-TP1 feature comparison

CD54HC132F/3A Intersil Corporation

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TC74HC00AF-TP1 Toshiba America Electronic Components

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer HARRIS SEMICONDUCTOR TOSHIBA CORP
Reach Compliance Code unknown unknown
Family HC/UH HC/UH
JESD-30 Code R-CDIP-T14 R-PDSO-G14
JESD-609 Code e0 e0
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 188 ns 19 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 3 1
Pbfree Code No
Part Package Code SOIC
Package Description SOP,
Pin Count 14
HTS Code 8542.39.00.01
Length 10.3 mm
Load Capacitance (CL) 50 pF
Package Code SOP
Seated Height-Max 1.9 mm
Supply Voltage-Nom (Vsup) 5 V
Terminal Pitch 1.27 mm
Width 5.3 mm

Compare CD54HC132F/3A with alternatives

Compare TC74HC00AF-TP1 with alternatives