CD54HC132F3A vs 74HC132D/T3 feature comparison

CD54HC132F3A Rochester Electronics LLC

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74HC132D/T3 NXP Semiconductors

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC NXP SEMICONDUCTORS
Part Package Code DIP SOIC
Package Description DIP, SOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
kg CO2e/kg 12.4
Average Weight (mg) 1630.6
CO2e (mg) 20219.441
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level NOT SPECIFIED 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 4 1
HTS Code 8542.39.00.01
Length 8.65 mm
Propagation Delay (tpd) 38 ns
Qualification Status Not Qualified
Seated Height-Max 1.75 mm
Terminal Pitch 1.27 mm
Width 3.9 mm

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