CD54HC132F3A vs CD54HCT132F3A feature comparison

CD54HC132F3A Intersil Corporation

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CD54HCT132F3A Harris Semiconductor

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Source Content uid CD54HC132F3A
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-GDIP-T14
JESD-609 Code e0 e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 2/6 V 5 V
Prop. Delay@Nom-Sup 38 ns 50 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Screening Level 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 4 3
Family HCT
Number of Functions 4
Number of Inputs 2
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V

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