CD54HC157F vs HD74HC157P-E feature comparison

CD54HC157F General Electric Solid State

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HD74HC157P-E Renesas Electronics Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer GENERAL ELECTRIC SOLID STATE RENESAS ELECTRONICS CORP
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Base Number Matches 6 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Package Description DIP,
Pin Count 16
Family HC/UH
JESD-30 Code R-PDIP-T16
JESD-609 Code e4
Length 19.2 mm
Logic IC Type MULTIPLEXER
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Number of Outputs 1
Number of Terminals 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Propagation Delay (tpd) 155 ns
Qualification Status Not Qualified
Seated Height-Max 5.06 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

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