CD54HC652H vs GTLP18T612GX feature comparison

CD54HC652H Harris Semiconductor

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GTLP18T612GX Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer HARRIS SEMICONDUCTOR ROCHESTER ELECTRONICS INC
Package Description DIE, LFBGA,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Additional Feature SELECT INPUT FOR MULTIPLEXED TRANSMISSION OF REGISTERED/REAL TIME DATA
Family HC/UH GTLP
JESD-30 Code X-XUUC-N24 R-PBGA-B54
Load Capacitance (CL) 50 pF
Logic IC Type REGISTERED BUS TRANSCEIVER REGISTERED BUS TRANSCEIVER
Number of Bits 8 18
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 24 54
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE OPEN-DRAIN/3-STATE
Output Polarity TRUE TRUE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE LFBGA
Package Equivalence Code DIE OR CHIP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd) 66 ns 6.5 ns
Qualification Status Not Qualified COMMERCIAL
Supply Voltage-Max (Vsup) 6 V 3.45 V
Supply Voltage-Min (Vsup) 2 V 3.15 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS BICMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form NO LEAD BALL
Terminal Position UPPER BOTTOM
Base Number Matches 2 2
Pbfree Code No
Rohs Code No
Part Package Code BGA
Pin Count 54
Length 8 mm
Moisture Sensitivity Level NOT SPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.4 mm
Terminal Finish NOT SPECIFIED
Terminal Pitch 0.8 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.5 mm

Compare CD54HC652H with alternatives

Compare GTLP18T612GX with alternatives