CD54HC688F vs MC54HC688J feature comparison

CD54HC688F Intersil Corporation

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MC54HC688J Motorola Semiconductor Products

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP MOTOROLA INC
Package Description DIP-20 DIP, DIP20,.3
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T20 R-CDIP-T20
JESD-609 Code e0 e0
Logic IC Type MAGNITUDE COMPARATOR IDENTITY COMPARATOR
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 6 3
Additional Feature CASCADABLE
Family HC/UH
Length 24.515 mm
Load Capacitance (CL) 50 pF
Number of Bits 8
Number of Functions 1
Output Polarity INVERTED
Propagation Delay (tpd) 63 ns
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Width 7.62 mm

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