CD54HC75F3A
vs
100355MW8
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
DIP, DIP16,.3
|
DIE,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HC/UH
|
100K
|
JESD-30 Code |
R-CDIP-T16
|
X-XUUC-N
|
JESD-609 Code |
e0
|
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
D LATCH
|
D LATCH
|
Max I(ol) |
0.004 A
|
|
Number of Bits |
2
|
4
|
Number of Functions |
2
|
1
|
Number of Terminals |
16
|
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
Package Code |
DIP
|
DIE
|
Package Equivalence Code |
DIP16,.3
|
DIE OR CHIP
|
Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
Package Style |
IN-LINE
|
UNCASED CHIP
|
Prop. Delay@Nom-Sup |
33 ns
|
|
Propagation Delay (tpd) |
195 ns
|
2.2 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
|
Supply Voltage-Max (Vsup) |
6 V
|
|
Supply Voltage-Min (Vsup) |
2 V
|
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
ECL
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
UPPER
|
Trigger Type |
HIGH LEVEL
|
LOW LEVEL
|
Base Number Matches |
1
|
1
|
|
|
|
Compare CD54HC75F3A with alternatives
Compare 100355MW8 with alternatives