CD54HCT00F/3
vs
74HC132PW-Q100,118
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
RCA SOLID STATE
|
NXP SEMICONDUCTORS
|
| Package Description |
,
|
4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| JESD-609 Code |
e0
|
|
| Terminal Finish |
TIN LEAD
|
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
14
|
| Manufacturer Package Code |
|
SOT402-1
|
| Family |
|
HC/UH
|
| JESD-30 Code |
|
R-PDSO-G14
|
| Length |
|
5 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Logic IC Type |
|
NAND GATE
|
| Max I(ol) |
|
0.004 A
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
4
|
| Number of Inputs |
|
2
|
| Number of Terminals |
|
14
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP14,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
38 ns
|
| Propagation Delay (tpd) |
|
190 ns
|
| Qualification Status |
|
Not Qualified
|
| Schmitt Trigger |
|
YES
|
| Screening Level |
|
AEC-Q100
|
| Seated Height-Max |
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
|
6 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
4.4 mm
|
|
|
|