CD54HCT00F/3 vs MC74HC132ANG feature comparison

CD54HCT00F/3 Intersil Corporation

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MC74HC132ANG onsemi

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR ONSEMI
Package Description , DIP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 1630.6
CO2e (mg) 20219.441 20219.441
Family HCT HC/UH
JESD-30 Code R-CDIP-T14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 30 ns 190 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 14
ECCN Code EAR99
Samacsys Manufacturer onsemi
JESD-609 Code e3
Length 18.86 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Output Characteristics 3-STATE
Package Equivalence Code DIP14,.3
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 38 ns
Schmitt Trigger YES
Seated Height-Max 4.69 mm
Terminal Finish Tin (Sn)
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) 40
Width 7.62 mm

Compare CD54HCT00F/3 with alternatives

Compare MC74HC132ANG with alternatives