CD54HCT00F/3A vs MM74HCT00N feature comparison

CD54HCT00F/3A Intersil Corporation

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MM74HCT00N Texas Instruments

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer HARRIS SEMICONDUCTOR NATIONAL SEMICONDUCTOR CORP
Package Description , DIP, DIP14,.3
Reach Compliance Code unknown unknown
Family HCT HCT
JESD-30 Code R-CDIP-T14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 30 ns 29 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 5
Rohs Code No
Part Package Code DIP
Pin Count 14
HTS Code 8542.39.00.01
JESD-609 Code e0
Length 19.18 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Code DIP
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 29 ns
Schmitt Trigger NO
Seated Height-Max 5.08 mm
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Width 7.62 mm

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