CD54HCT00F3A vs 74HC132DB,112 feature comparison

CD54HCT00F3A Rochester Electronics LLC

Buy Now Datasheet

74HC132DB,112 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Contact Manufacturer Transferred
Part Package Code DIP SSOP1
Package Description DIP, SSOP, SSOP14,.3
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 4 2
Source Content uid 74HC132DB,112
Rohs Code Yes
Manufacturer Package Code SOT337-1
JESD-609 Code e4
Length 6.2 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SSOP14,.3
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 31 ns
Propagation Delay (tpd) 38 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Seated Height-Max 2 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm

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Compare 74HC132DB,112 with alternatives

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