Findchips: Compare CD54HCT00F3A vs 74HCT132D,652

CD54HCT00F3A vs 74HCT132D,652 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Contact Manufacturer	Transferred
Ihs Manufacturer	ROCHESTER ELECTRONICS LLC	NXP SEMICONDUCTORS
Part Package Code	DIP	SOIC
Package Description	DIP,	SOT-108-1, SO-14
Pin Count	14	14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HCT	HCT
JESD-30 Code	R-GDIP-T14	R-PDSO-G14
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
Package Code	DIP	SOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE
Propagation Delay (tpd)	30 ns	50 ns
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Position	DUAL	DUAL
Base Number Matches	4	2
Rohs Code		Yes
Manufacturer Package Code		SOT108-1
Factory Lead Time		4 Weeks
JESD-609 Code		e4
Length		8.65 mm
Load Capacitance (CL)		50 pF
Max I(ol)		0.004 A
Moisture Sensitivity Level		1
Package Equivalence Code		SOP14,.25
Packing Method		BULK
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		41 ns
Qualification Status		Not Qualified
Schmitt Trigger		YES
Seated Height-Max		1.75 mm
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch		1.27 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		3.9 mm
	Logic » Gates	Logic » Gates