CD54HCT00F3A vs CD74HC132EX feature comparison

CD54HCT00F3A Rochester Electronics LLC

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CD74HC132EX Harris Semiconductor

Buy Now Datasheet
Part Life Cycle Code Contact Manufacturer Obsolete
Part Package Code DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HC/UH
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 2
Rohs Code No
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 38 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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