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CD54HCT00F3A Texas InstrumentsBuy Now Datasheet |
MC74HC132ADDR2 Motorola Semiconductor ProductsBuy Now |
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| Part Life Cycle Code | Active | Obsolete |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | MOTOROLA INC |
| Part Package Code | DIP | |
| Package Description | DIP, DIP14,.3 | SOP, |
| Pin Count | 14 | |
| Reach Compliance Code | not_compliant | unknown |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | 8542.39.00.01 |
| Factory Lead Time | 6 Weeks | |
| Family | HCT | HC/UH |
| JESD-30 Code | R-CDIP-T14 | R-PDSO-G14 |
| JESD-609 Code | e0 | |
| Length | 19.56 mm | 8.65 mm |
| Load Capacitance (CL) | 50 pF | 50 pF |
| Logic IC Type | NAND GATE | NAND GATE |
| Max I(ol) | 0.004 A | |
| Number of Functions | 4 | 4 |
| Number of Inputs | 2 | 2 |
| Number of Terminals | 14 | 14 |
| Operating Temperature-Max | 125 °C | 125 °C |
| Operating Temperature-Min | -55 °C | -55 °C |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| Package Code | DIP | SOP |
| Package Equivalence Code | DIP14,.3 | |
| Package Shape | RECTANGULAR | RECTANGULAR |
| Package Style | IN-LINE | SMALL OUTLINE |
| Packing Method | TUBE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Power Supplies | 5 V | |
| Power Supply Current-Max (ICC) | 0.04 mA | |
| Prop. Delay@Nom-Sup | 30 ns | |
| Propagation Delay (tpd) | 30 ns | 38 ns |
| Qualification Status | Not Qualified | Not Qualified |
| Schmitt Trigger | NO | |
| Screening Level | 38535Q/M;38534H;883B | |
| Seated Height-Max | 5.08 mm | 1.75 mm |
| Supply Voltage-Max (Vsup) | 5.5 V | 6 V |
| Supply Voltage-Min (Vsup) | 4.5 V | 2 V |
| Supply Voltage-Nom (Vsup) | 5 V | 5 V |
| Surface Mount | NO | YES |
| Technology | CMOS | CMOS |
| Temperature Grade | MILITARY | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | GULL WING |
| Terminal Pitch | 2.54 mm | 1.27 mm |
| Terminal Position | DUAL | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 7.62 mm | 3.9 mm |
| Base Number Matches | 4 | 2 |
