CD54HCT00F3A vs MC74HC132ANG feature comparison

CD54HCT00F3A Rochester Electronics LLC

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MC74HC132ANG onsemi

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Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC ON SEMICONDUCTOR
Part Package Code DIP DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HC/UH
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 30 ns 190 ns
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 1
Source Content uid MC74HC132ANG
Pbfree Code Yes
Rohs Code Yes
ECCN Code EAR99
JESD-609 Code e3
Length 18.86 mm
Load Capacitance (CL) 50 pF
Max I(ol) 4 A
Output Characteristics 3-STATE
Package Equivalence Code DIP14,.3
Peak Reflow Temperature (Cel) 260
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 38 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Seated Height-Max 4.69 mm
Terminal Finish Tin (Sn)
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) 40
Width 7.62 mm

Compare CD54HCT00F3A with alternatives

Compare MC74HC132ANG with alternatives