CD54HCT00F3A vs MM74HC00MX feature comparison

CD54HCT00F3A Rochester Electronics LLC

Buy Now Datasheet

MM74HC00MX Texas Instruments

Buy Now Datasheet
Part Life Cycle Code Contact Manufacturer Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP SOIC
Package Description DIP, SOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 30 ns 23 ns
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 4 5
Length 8.65 mm
Load Capacitance (CL) 50 pF
Qualification Status Not Qualified
Seated Height-Max 1.75 mm
Terminal Pitch 1.27 mm
Width 3.9 mm

Compare CD54HCT00F3A with alternatives

Compare MM74HC00MX with alternatives