CD54HCT00F3A vs MM74HC132M feature comparison

CD54HCT00F3A Rochester Electronics LLC

Buy Now Datasheet

MM74HC132M Rochester Electronics LLC

Buy Now Datasheet
Part Life Cycle Code Contact Manufacturer Active
Ihs Manufacturer ROCHESTER ELECTRONICS LLC ROCHESTER ELECTRONICS INC
Part Package Code DIP SOIC
Package Description DIP, SOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HCT HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 30 ns 125 ns
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 4 5
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e3
Length 8.6235 mm
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.753 mm
Terminal Finish MATTE TIN
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

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