CD54HCT00F3A vs SN54HC132J feature comparison

CD54HCT00F3A Rochester Electronics LLC

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SN54HC132J Texas Instruments

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Part Life Cycle Code Contact Manufacturer Active
Ihs Manufacturer ROCHESTER ELECTRONICS LLC TEXAS INSTRUMENTS INC
Part Package Code DIP DIP
Package Description DIP, CERAMIC, DIP-14
Pin Count 14 14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HC/UH
JESD-30 Code R-GDIP-T14 R-GDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 30 ns 186 ns
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 1
Pbfree Code Yes
Rohs Code No
ECCN Code EAR99
Samacsys Manufacturer Texas Instruments
JESD-609 Code e0
Length 19.56 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.0052 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.04 mA
Prop. Delay@Nom-Sup 37 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Seated Height-Max 5.08 mm
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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