CD54HCT02F3A vs TC74HCT02AP feature comparison

CD54HCT02F3A Harris Semiconductor

Buy Now Datasheet

TC74HCT02AP Toshiba America Electronic Components

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR TOSHIBA CORP
Package Description DIP-14 DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-GDIP-T14 R-PDIP-T14
JESD-609 Code e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 32 ns 23 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Screening Level 38535Q/M;38534H;883B
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Part Package Code DIP
Pin Count 14
Length 19.25 mm
Propagation Delay (tpd) 23 ns
Seated Height-Max 4.45 mm
Width 7.62 mm

Compare CD54HCT02F3A with alternatives

Compare TC74HCT02AP with alternatives