CD54HCT132F/3 vs MM74HCT00N feature comparison

CD54HCT132F/3 Harris Semiconductor

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MM74HCT00N Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer HARRIS SEMICONDUCTOR ROCHESTER ELECTRONICS INC
Package Description , DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HCT HCT
JESD-30 Code R-CDIP-T14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 50 ns 29 ns
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 5
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 14
JESD-609 Code e3
Length 19.18 mm
Moisture Sensitivity Level NOT APPLICABLE
Peak Reflow Temperature (Cel) NOT APPLICABLE
Seated Height-Max 5.08 mm
Terminal Finish MATTE TIN
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Width 7.62 mm

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