CD54HCT153H/3
vs
M38510/76207BEX
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
QP SEMICONDUCTOR INC
|
| Package Description |
DIE,
|
DIP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HCT
|
AC
|
| JESD-30 Code |
X-XUUC-N16
|
R-GDIP-T16
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
2
|
4
|
| Number of Inputs |
4
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIE
|
DIP
|
| Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
IN-LINE
|
| Propagation Delay (tpd) |
51 ns
|
11.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Position |
UPPER
|
DUAL
|
| Base Number Matches |
2
|
3
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
16
|
| Output Characteristics |
|
3-STATE
|
| Screening Level |
|
MIL-M-38510 Class B
|
|
|
|
Compare CD54HCT153H/3 with alternatives
Compare M38510/76207BEX with alternatives