CD54HCT153H/3 vs MC54HC257JD feature comparison

CD54HCT153H/3 Harris Semiconductor

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MC54HC257JD Freescale Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description DIE, DIP, DIP16,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HCT
JESD-30 Code X-XUUC-N16 R-XDIP-T16
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 2 4
Number of Inputs 4 2
Number of Outputs 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity TRUE
Package Body Material UNSPECIFIED CERAMIC
Package Code DIE DIP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Propagation Delay (tpd) 51 ns
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Base Number Matches 2 3
Rohs Code No
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code DIP16,.3
Power Supplies 2/6 V
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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