CD54HCT373F vs MM54HCT373J/883 feature comparison

CD54HCT373F Texas Instruments

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MM54HCT373J/883 Texas Instruments

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Pbfree Code Yes
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description CERAMIC, DIP-20 DIP, DIP20,.3
Pin Count 20
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Control Type ENABLE LOW
Count Direction UNIDIRECTIONAL
Family HCT
JESD-30 Code R-GDIP-T20 R-XDIP-T20
JESD-609 Code e0 e0
Length 24.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER D LATCH
Max I(ol) 0.006 A 0.006 A
Number of Bits 8 8
Number of Functions 8 1
Number of Ports 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.16 mA
Prop. Delay@Nom-Sup 48 ns
Propagation Delay (tpd) 53 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 6 3
Screening Level 38535Q/M;38534H;883B

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