Register or Sign In

CD54HCT377F3 vs 74HCT377D,652 feature comparison

CD54HCT377F3 Intersil Corporation

Buy Now Datasheet

74HCT377D,652 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description , PLASTIC, SO-20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH HOLD MODE WITH HOLD MODE
Family HCT HCT
JESD-30 Code R-CDIP-T20 R-PDSO-G20
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 57 ns 48 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 50 MHz 60 MHz
Base Number Matches 3 1
Rohs Code Yes
Part Package Code SOP
Pin Count 20
Manufacturer Package Code SOT163-1
Factory Lead Time 4 Weeks
JESD-609 Code e4
Length 12.8 mm
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 18000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP20,.4
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Seated Height-Max 2.65 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm
Logic » FF/Latches
Logic » FF/Latches

Compare CD54HCT377F3 with alternatives

Compare 74HCT377D,652 with alternatives