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CD54HCT377H/3 vs 74HCT377PW,118 feature comparison

CD54HCT377H/3 Harris Semiconductor

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74HCT377PW,118 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description DIE, PLASTIC, TSSOP-20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH HOLD MODE WITH HOLD MODE
Family HCT HCT
JESD-30 Code X-XUUC-N20 R-PDSO-G20
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE TSSOP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 57 ns 48 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 50 MHz 60 MHz
Base Number Matches 2 2
Rohs Code Yes
Part Package Code TSSOP2
Pin Count 20
Manufacturer Package Code SOT360-1
Factory Lead Time 4 Weeks
JESD-609 Code e4
Length 6.5 mm
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 18000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP20,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.1 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm
Logic » FF/Latches
Logic » FF/Latches

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Compare 74HCT377PW,118 with alternatives