CD54HCT377H/3 vs GD54HCT377J feature comparison

CD54HCT377H/3 Intersil Corporation

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GD54HCT377J LG Semicon Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR LG SEMICON CO LTD
Package Description DIE, DIP, DIP20,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH HOLD MODE
Family HCT
JESD-30 Code X-XUUC-N20 R-XDIP-T20
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8
Number of Functions 1 8
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity TRUE
Package Body Material UNSPECIFIED CERAMIC
Package Code DIE DIP
Package Equivalence Code DIE OR CHIP DIP20,.3
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Propagation Delay (tpd) 57 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 50 MHz
Base Number Matches 2 2
Rohs Code No
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 18000000 Hz
Max I(ol) 0.004 A
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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