CD74AC112E vs 74HC109DB,112 feature comparison

CD74AC112E Rochester Electronics LLC

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74HC109DB,112 NXP Semiconductors

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Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS INC NXP SEMICONDUCTORS
Part Package Code DIP SSOP1
Package Description DIP, SOT-338-1, SSOP-16
Pin Count 16 16
Reach Compliance Code unknown compliant
Family AC HC/UH
JESD-30 Code R-PDIP-T16 R-PDSO-G16
Length 19.17 mm 6.2 mm
Logic IC Type J-K FLIP-FLOP J-KBAR FLIP-FLOP
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 10.3 ns 265 ns
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 5.33 mm 2 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 1.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE POSITIVE EDGE
Width 7.62 mm 5.3 mm
fmax-Min 100 MHz 24 MHz
Base Number Matches 8 2
Rohs Code Yes
Manufacturer Package Code SOT338-1
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SSOP16,.3
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

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