CD74AC238MX vs 74HC139PW feature comparison

CD74AC238MX Ge Solid State

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74HC139PW NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer GE SOLID STATE NXP SEMICONDUCTORS
Package Description , SOT-403-1, TSSOP-16
Reach Compliance Code unknown compliant
Family AC HC/UH
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 2-LINE TO 4-LINE DECODER
Number of Functions 1 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 15 ns 44 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 1.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code TSSOP
Pin Count 16
ECCN Code EAR99
HTS Code 8542.39.00.01
JESD-609 Code e4
Length 5 mm
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Code TSSOP
Package Equivalence Code TSSOP16,.25
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 44 ns
Seated Height-Max 1.1 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm

Compare CD74AC238MX with alternatives

Compare 74HC139PW with alternatives