CD74AC32MX vs M74HC4075B1R feature comparison

CD74AC32MX Ge Solid State

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M74HC4075B1R STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GE SOLID STATE STMICROELECTRONICS
Package Description , PLASTIC, DIP-14
Reach Compliance Code unknown unknown
Family AC HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Number of Functions 4 3
Number of Inputs 2 3
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 9.5 ns 120 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 1.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 14
HTS Code 8542.39.00.01
Samacsys Manufacturer STMicroelectronics
JESD-609 Code e4
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Prop. Delay@Nom-Sup 24 ns
Schmitt Trigger NO
Seated Height-Max 5.1 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare CD74AC32MX with alternatives

Compare M74HC4075B1R with alternatives