CD74ACT623M96
vs
IDT74FCT16245ETE
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
RENESAS ELECTRONICS CORP
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION
|
WITH DIRECTION CONTROL
|
| Control Type |
INDEPENDENT CONTROL
|
|
| Count Direction |
BIDIRECTIONAL
|
|
| Family |
ACT
|
FCT
|
| JESD-30 Code |
R-PDSO-G20
|
R-GDFP-F48
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Max I(ol) |
0.024 A
|
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
48
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DFP
|
| Package Equivalence Code |
SOP20,.4
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Packing Method |
TR
|
|
| Prop. Delay@Nom-Sup |
10.6 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
2
|
| Package Description |
|
DFP,
|
| Length |
|
15.875 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Propagation Delay (tpd) |
|
3.2 ns
|
| Seated Height-Max |
|
2.413 mm
|
| Width |
|
9.652 mm
|
|
|
|
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