CD74HC00EX vs 8403701CA feature comparison

CD74HC00EX Intersil Corporation

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8403701CA Motorola Semiconductor Products

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP MOTOROLA INC
Package Description DIP, DIP14,.3 ,
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Terminals 14 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Prop. Delay@Nom-Sup 27 ns
Schmitt Trigger NO
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Base Number Matches 2 5
Family HC/UH
Length 8.89 mm
Moisture Sensitivity Level NOT APPLICABLE
Number of Functions 4
Number of Inputs 2
Peak Reflow Temperature (Cel) NOT APPLICABLE
Propagation Delay (tpd) 135 ns
Seated Height-Max 2.03 mm
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Width 8.89 mm

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