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CD74HC00EX vs GD54HC00J feature comparison

CD74HC00EX Intersil Corporation

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GD54HC00J LG Semicon Co Ltd

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP LG SEMICON CO LTD
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code not_compliant unknown
JESD-30 Code R-PDIP-T14 R-XDIP-T14
JESD-609 Code e0 e0
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 2/6 V 2/6 V
Prop. Delay@Nom-Sup 27 ns 27 ns
Schmitt Trigger NO NO
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Qualification Status Not Qualified

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