CD74HC00EX vs M74HCT00RM13TR feature comparison

CD74HC00EX Harris Semiconductor

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M74HCT00RM13TR STMicroelectronics

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR STMICROELECTRONICS
Package Description DIP, DIP14,.3 SOP, SOP14,.25
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 215.8
CO2e (mg) 20219.441 2675.92
Family HC/UH HCT
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 27 ns 29 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code SOIC
Pin Count 14
Length 8.65 mm
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 29 ns
Seated Height-Max 1.75 mm
Time@Peak Reflow Temperature-Max (s) 40
Width 3.9 mm

Compare CD74HC00EX with alternatives

Compare M74HCT00RM13TR with alternatives