CD74HC00M96 vs 74HC03DB-Q100 feature comparison

CD74HC00M96 Intersil Corporation

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74HC03DB-Q100 NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTERSIL CORP NXP SEMICONDUCTORS
Package Description PLASTIC, SOP-14 SSOP,
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 215.8 149.35
CO2e (mg) 2675.92 1851.94
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Packing Method TR
Prop. Delay@Nom-Sup 27 ns
Propagation Delay (tpd) 115 ns 145 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Part Package Code SSOP
Pin Count 14
Length 6.2 mm
Output Characteristics OPEN-DRAIN
Screening Level AEC-Q100
Seated Height-Max 2 mm
Width 5.3 mm