CD74HC11M vs HD74HC11RPEL feature comparison

CD74HC11M Rochester Electronics LLC

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HD74HC11RPEL Renesas Electronics Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description PACKAGE-14 SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Logic IC Type AND GATE AND GATE
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 125 ns 125 ns
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 5 3
Pbfree Code Yes
Rohs Code Yes
Length 8.65 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 25 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.75 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 20
Width 3.95 mm

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