CD74HC132E vs 74HC03DB feature comparison

CD74HC132E General Electric Solid State

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74HC03DB NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer GENERAL ELECTRIC SOLID STATE NXP SEMICONDUCTORS
Package Description DIP-14 SOT-337-1, SSOP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SSOP
Package Equivalence Code DIP14,.3 SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Prop. Delay@Nom-Sup 31 ns 29 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 6 2
Pbfree Code Yes
Part Package Code SSOP
Pin Count 14
Family HC/UH
JESD-609 Code e4
Length 6.2 mm
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Output Characteristics OPEN-DRAIN
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 29 ns
Seated Height-Max 2 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm

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