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CD74HC132E vs GD74HC132D feature comparison

CD74HC132E General Electric Solid State

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GD74HC132D LG Semicon Co Ltd

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer GENERAL ELECTRIC SOLID STATE LG SEMICON CO LTD
Package Description DIP, DIP14,.3 SOP, SOP14,.25
Reach Compliance Code unknown unknown
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Power Supplies 2/6 V 2/6 V
Prop. Delay@Nom-Sup 31 ns 30 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 6 2
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)

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